以600mm×600mm面板为例，其面积是12英寸晶圆载板的5.1倍，单片产出芯片数量大幅增加。同时，FOPLP的面积利用率超95%，显著优于传统晶圆级封装的85%，同等面积下面板可多容纳1.64倍芯片。基板面积增大持续降低成本，200mm向300mm过渡节约25%成本，300mm向板级封装过渡更可节约66%成本。
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There are five rounds to the game. The first round sees you trying to guess the word, with correct, misplaced, and incorrect letters shown in each guess. If you guess the correct answer, it'll take you to the next hurdle, providing the answer to the last hurdle as your first guess. This can give you several clues or none, depending on the words. For the final hurdle, every correct answer from previous hurdles is shown, with correct and misplaced letters clearly shown.